Diamond Wire

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  • Diamond Wire
,結合本公司獨特的 EP 電著技術與 RB 高分子膠連技術,製造出優異的電鍍鑽石線(EP diamond wires)及 樹酯鑽石線(RB diamond wires),在業界應用中,展現傑出的切削效率、良好的完工品質與具成本競爭力的加工應用。

Application

This product can be applied to various materials such as Sapphire Ingot, Silicon Ingot (mono/poly), Precision Glass Ceramic, Quartz, Crystal, Synthetic Crystal, etc.。


Characteristics

• Good wire diameter control and uniform appearance
• Outstanding wire strength and tension technology.
• Excellent cutting ability
• Compared to the conventional process, it reduces 50% of cutting time
• good machining accuracy and surface completion
• can be used with varopis device applications

Specification

EP Dia. Wire Diameter Application
Ø 420 μm (Core Ø 350 μm ) Cropping
Ø 350 μm (Core Ø 250 μm ) Squaring
Ø 250 μm (Core Ø 180 μm ) Slicing
Ø 200 μm (Core Ø 160 μm ) Slicing
Ø 150 μm (Core Ø 120 μm ) Slicing
Ø 140 μm (Core Ø 120 μm ) Slicing
Ø 130 μm (Core Ø 110 μm ) Slicing
Ø 120 μm (Core Ø 100 μm ) Slicing
Ø 110 μm (Core Ø 90 μm ) Slicing
Ø 100 μm (Core Ø 80 μm ) Slicing
RB Dia. Wire Diameter Application
Ø 250 μm (Core Ø 180 μm ) Slicing
Ø 145 μm (Core Ø 120 μm ) Slicing
Ø 135 μm (Core Ø 110 μm ) Slicing
Ø 125 μm (Core Ø 100 μm ) Slicing