MDWEC

•Epoxy Adhesive - GigaBondF1

GIGABOND Is Two Compounds , Consist Of A (Resin) And B (Hardener). This Removable Adhesive Is Designed For Ingot Slicing, Quick Cure, High Adhesion Type Which Can Be Removed By Hot Water. This Adhesives Features No Peculiar Odor, Non-Flammability And Non-Evaporative Characteristics. Excellent Wafer Accuracy And Surface Finish 3~5 Times The Cut Rate Of Bare Wire And Slurry Technology Highly Uniform Grain Distribution Around And Along Wire Ensures Consistent Cutting Action. Fixed-Diamond Technology Eliminates Slurry Recycling And Disposal Concerns Compatible With Broad Range Of Single And Multi-Wire Saws Can Be Spooled Directly Onto Customer Reels Available For Variety Crystal Ingot, Such As Mono-/Poly- Silicon For Semiconductor, Solar Cell, Sapphire, GaAs. And, Also Available Brittle Materials Such As Quartz, Crystal, Glass, Ceramics, Ferrite, Metal/Alloy & Etc.
	Demounting GigaBond F1 can be easily removed by dipping into hot water (80~90℃) for around 30min..