•Wire Saws uMWS-1170

• High Accuracy Motion
• PLC Program Control
• Stable Structure
• Unique Coolant Tank Recycle System
• Slicing various materials
• Available for Free Abrasive Sawing & Fixed Abrasive Sawing

• Excellent wafer accuracy and surface finish
• 3~5 times the cut rate of bare wire and slurry technology
• Highly uniform grain distribution around and along wire ensures consistent cutting action.
• Fixed-diamond technology eliminates slurry recycling and disposal concerns
• Compatible with broad range of single and multi-wire saws
• Can be spooled directly onto customer reels

• Quartz, Glass, Semi Conductor Wafer (LiTaO3, LiNBO3, Li2B4O3, Sapphire, ZnO, GaAs, ALN, InAs…etc), also suitable for Solar Application (Mono/Poly Silicon), Ceramic, SiC, etc. Industries including Semi Conductors, LED, Solar, Opto,..etc
  

• High Quality - Excellent surface.
• High Speed - Shorten 50% working time than free abrasives.
• High Compatible - Available for brittle & hard material slicing.
• High Efficiency - Low kerfs-off, decreasing the working time for next process.
• High User Friendly - Easy to operate and maintain.