•Micron Diamond Coating Wire

MDWEC The diamond coated wire is guided by guide rollers and forms a frame, which is impregnated with water during the sawing process. The workpiece is bonded to a support and pressed against the frame (constant pressing force). The wires are cutting the workpiece into slices.

Feature of diamond

• Excellent wafer accuracy and surface finish
• 3~5 times the cut rate of bare wire and slurry technology
• Highly uniform grain distribution around and along wire ensures consistent cutting action.
• Fixed-diamond technology eliminates slurry recycling and disposal concerns
• Compatible with broad range of single and multi-wire saws
• Can be spooled directly onto customer reels